1. It was developed with a 355nm ultraviolet laser. Compared with the infrared laser, the machine adopts the third-order intracavity frequency doubling technology, and the 355 ultraviolet light focused spot is extremely small, which can greatly reduce the mechanical deformation of the material and the processing heat has little impact.
2. High-energy ultraviolet photons directly break the molecular bonds on the surface of many non-metallic materials, separating the molecules from the object. This method does not generate high heat, the UV laser focuses on the spot small, and the processing has almost no thermal effect. Therefore, it is called cold working, so it is suitable for ultra-fine marking and engraving of special materials.
3. Mainly used for ultra-fine large table and engraving, especially suitable for marking food and medical packaging materials, drilling micro holes, high-speed segmentation of glass materials and complex graphic cutting of silicon wafers. It integrates advanced technology at home and abroad.
